1st Asia-Pacific Atomic Layer Deposition (AP-ALD) Conference
AP-ALD 2024
October 17(Thu.) - 20(Sun.),2024
Sheraton Shanghai Waigaoqiao Hotel |Shanghai,China
Overview
Following the successes of the previous four international Conferences on ALD Applications and ten China ALD Conferences since 2010. the 2024 1st Asia-Pacific Atomic Layer Deposition (AP-ALD) Conference will be a four-day meeting, dedicated to the fundamentals and applications of Atomic Layer Deposition (ALD) technology in various fields. It will be held in Shanghai, China, from October 17 to 20, 2024. This conference will feature plenary sessions, oral sessions, poster sessions and industrial exhibitions.
The ALD technique has been widely used and explored in numerous fields such as microelectronics, photoelectronics, optical coating, functional nanomaterials, MEMS/NEMS, energy storage, biotechnology, catalysis technology and etc. This is attributed to some unique advantages of ALD, including precise control of nano-scale thickness, superior uniformity across a large area, excellent conformity, relatively low deposition temperature and stoichiometric composition. Especially in the field of microelectronics, ALD has been involved deeply into advanced integrated circuits to prepare high-k/metal gate, spacer, and ultrathin diffusion barriers for Cu interconnects etc. Furthermore, ALD is also receiving great attention for its potential application in photovoltaics, flexible electronics, organic electronics, flat-panel display and other emerging areas.
Scope
This conference will cover the following aspects:
⚫ ALD Fundamentals
ALD Precursors and Precursor Design
ALD Surface Chemistry
Simulation, Modeling, and Theory of ALD Growth
⚫ ALD Process and Instruments
Plasma and Other Energy-Enhanced ALD Methods
Molecular layer deposition and atomic layer infiltration
⚫ ALD for Microelectronics
⚫ ALD for Photovatics/Display & other Optoelectronics
⚫ ALD for Batteries/Supercapacitors/Catalysis/Fuel cell
⚫ ALD for sensors/membranes/emerging applications
⚫ Area-selective ALD
⚫ Atomic Layer Etching (ALE) and related topics such as
atomic layer cleaning
Program
Day 1
17 Oct, 2024
02:00 P.m. - 09:00 P.m.
REGISTRATION
Hotel lobby on the first floor
Day 2
18 Oct, 2024
08:45 A.m. - 06:00 P.m.
SPEECH
Conference Room
Day 3
19 Oct, 2024
09:00 A.m. - 06:00 P.m.
SPEECH
Conference Room
Day 4
20 Oct, 2024
09:00 A.m. - 12:00 P.m.
SPEECH
Conference Room
Conference Chairs
Program Chair:
Prof. Rong Chen,
Huazhong University of Science & Technology
Co-Chair:
Prof. Soo-Hyun Kim,
Ulsan National Institute of Science and Technology
Key Dates
Abstract Submission Deadline:
Sep. 30, 2024
Early Registration Deadline:
Aug. 31, 2024